The upcoming Xiaomi 18 Fold foldable phone, expected to be Xiaomi’s first model priced above 10,000 yuan (about $1,450), has appeared on GeekBench AI benchmarks. The device, identified by model number 2608BPX34C, reportedly runs on the new XRING O3 chip, reaching a maximum CPU frequency of 4.36 GHz.
This model first surfaced in the GSMA IMEI database in December 2025 and was spotted again in April 2026, bearing the codename “lhasa.” These details support expectations that the phone launching with this hardware will be the Xiaomi 18 Fold.
XRING O3 Chip Details and Performance
The GeekBench AI records show the XRING O3 chipset in a ten-core full big-core CPU layout. Previous reports clarify this design as six super big cores plus four big cores, running up to 4.35 GHz. The GPU is the newly introduced 16-core G2-Ultra NX, which supports third-generation ray tracing, marking a significant advancement in graphics processing for Xiaomi devices.
Pricing and Market Position
According to Chinese sources, the Xiaomi 18 Fold will have a starting price around 12,000 yuan (~$1,785) across all variants, making it Xiaomi’s first phone to exceed the 10,000 yuan mark. This pricing positions the device in the premium segment for foldable smartphones.
The phone is expected to officially launch in September, with reservation campaigns already underway, highlighting its use of the in-house developed XRING O3 AI processor as a key selling point.
