Xiaomi has officially confirmed its upcoming XRING system-on-chips (SoCs), including the XRING O3, D100, and O100, set to debut alongside HyperOS 4 in September 2026. These new chips target AI applications across people, cars, and smart homes, indicating Xiaomi’s push into more specialized AI processing hardware.
XRING O3: A Flagship AI Powerhouse
The XRING O3 aims to be Xiaomi’s top-tier SoC, built on a 3nm manufacturing process. It features a 24-core AI architecture with a 14-core NPU and a 20-core CPU. The chip reportedly reaches speeds up to 4.35GHz on its 10-core CPU (6 super cores plus 4 large cores), with an AnTuTu V11 score of 5.22 million under controlled low-temperature lab conditions.
Notable technical highlights include:
- 1.22 TB/s AI acceleration bandwidth using advanced 6nm 3D wafer-level stacking technology
- Wafer-on-wafer packaging with hybrid bonding and 2.58 million physical interconnections spaced only 1.4µm apart
- First chip to support LPDDR6 memory, delivering 10,667 Mbps speeds and 113.8GB/s bandwidth, a 48% improvement over LPDDR5X
- GPU featuring a 16-core G2-Ultra NX with 85% higher peak performance, 182% better ray tracing, and 64% reduced power consumption compared to predecessors
- Quad-core NPU offering 200 TOPS for tensor computing and support for edge AI inference models
The XRING O3 also supports up to 160GB of unified memory and multi-chip fusion, enhancing its utility for AI tasks, intelligent driving, and high-performance computing.
Additional XRING Models and Packaging Technology
Alongside the XRING O3, Xiaomi is preparing the XRING D100 and XRING O100 for launch. The series showcases advanced packaging techniques like wafer-on-wafer stacking and hybrid bonding, designed to maximize performance and power efficiency through tight integration of high-speed AI-dedicated memory and matrix buses.
Confirmed Devices Launching with XRING O3
The Xiaomi 18 Fold and Xiaomi Pad 9 Pro Max are confirmed to use the XRING O3 SoC and will be among the first devices running HyperOS 4. Both are expected to launch initially in China, with stable versions of HyperOS 4 already in preparation for the Xiaomi Pad 9 series.
The timing suggests a coordinated launch event in September 2026 for the new devices, XRING SoCs, and HyperOS 4 ecosystem.
What This Means for Xiaomi’s AI and HyperOS Ecosystem
The XRING lineup marks Xiaomi’s move to highly specialized AI chips aimed at diverse sectors like automotive and smart home. The inclusion of features such as high-bandwidth AI acceleration, LPDDR6 memory, and edge AI support suggests Xiaomi is focusing on AI performance and efficiency at scale.
With upcoming devices like the Xiaomi 18 Fold and Xiaomi Pad 9 Pro Max adopting the XRING O3, Xiaomi appears poised to showcase these capabilities in flagship form factors with the new HyperOS 4 firmware.
Users interested in the rollout can keep an eye on stable update developments through tools like MemeOS Enhancer. Firmware packages for these new builds are likely to appear on MemeOSUpdates.com once released.
Previous Coverage
We previously reported on the early beta availability of HyperOS 4 and its new UI features as well as the potential role of XRING SoCs in powering this update. This announcement clarifies the official XRING models and confirms the devices set for the first official launch.
