Xiaomi has officially launched the XRING O3, its first AI flagship system-on-chip (SoC) to support LPDDR6 memory technology. This marks a significant milestone for Xiaomi, as the XRING O3 is the industry’s first SoC to integrate LPDDR6 RAM.
Changxin Memory as Core LPDDR6 Partner
According to supply chain sources cited by CAIJING, domestic Chinese memory leader Changxin Memory plays a central role in providing LPDDR6 memory for the XRING O3. Changxin Memory has been advancing LPDDR6 production since March, recently completing sample deliveries to key clients. Reports from August indicate that Changxin’s LPDDR6 modules are approaching the final stages of verification.
Technical Highlights of LPDDR6 on XRING O3
The LPDDR6 memory paired with XRING O3 delivers a data rate of 10667 Mbps and a 4×24 bit bus width. This enables a peak bandwidth of 113.8 GB/s, which is a 48% increase over the memory bandwidth on the previous XRING O1 chipset. This improvement supports the XRING O3’s performance boost and AI capabilities, especially in flagship-level device applications.
Implications for Domestic Memory Technology
This collaboration represents the first time Chinese-made LPDDR6 memory chips have been used in a flagship-tier processor, suggesting that domestic low-power DRAM technology is now competing among the global leaders. It puts the XRING O3 and Xiaomi at the forefront of SoC innovation leveraging emerging LPDDR6 technology.
Further details on devices running the XRING O3 chipset and rollout schedules have not been disclosed.
Source: ithome.com
