Xiaomi CEO Lei Jun has unveiled the Xiaomi 18 Fold, the brand’s most premium phone to date, ahead of the September 7 autumn flagship launch event. This foldable flagship features a red chassis and a wide horizontal foldable display. It debuts Xiaomi’s latest XRING O3 AI flagship processor and introduces the world’s first use of ChangXin LPDDR6 memory.
Design and Hardware Highlights
The Xiaomi 18 Fold adopts a wide folding design with a long horizontal camera module. The device’s side profile shows a relatively slim overall thickness despite a noticeably raised camera bump. The red exterior color and the foldable form factor position it as Xiaomi’s most high-end product so far.
New XRING O3 Chip and LPDDR6 Memory
This model is the first to use Xiaomi’s XRING O3 AI chip. The O3 is expected to bring advanced performance and AI capabilities, marking a significant upgrade over previous generations. Supporting this new processor, the 18 Fold also employs ChangXin’s LPDDR6 memory, which offers a peak speed of 12,800Mbps and comes in sizes up to 16GB, according to the chipmaker’s 2026 mid-year report.
Pricing and Market Positioning
Industry reports indicate that the Xiaomi 18 Fold’s pricing starts at about 12,000 Chinese yuan (approximately $1,670). This would make it Xiaomi’s first phone with a starting price above 10,000 yuan ($1,500), highlighting its flagship status. This device is China only.
