Qualcomm officially names Snapdragon 8 Elite Gen 6 and Elite Extreme Gen 6 chips

Qualcomm’s next-generation flagship chips have been officially named ahead of the Snapdragon Summit scheduled for late September. The two new chips built on a 2nm manufacturing process are the Snapdragon 8 Elite Gen 6 (SM8950) and the Snapdragon 8 Elite Extreme Gen 6 (SM8975).

Details on the 2nm Snapdragon Flagship SoCs

The Snapdragon 8 Elite Gen 6 is described as the standard top-tier chip, while the Snapdragon 8 Elite Extreme Gen 6 is positioned as an even more premium version. Both chips mark Qualcomm’s first deployment of the 2nm fabrication technology, promising significant gains in power efficiency and performance for flagship Android devices launching next year.

Upcoming Snapdragon Summit and Expected Launch Timeline

Qualcomm will officially unveil these chips during its Snapdragon Summit from September 22 to 24 in Hawaii. Following the announcements, the new 2nm Snapdragon 8 series is expected to power multiple flagship Android phones in 2024, including high-end models from manufacturers like Xiaomi and POCO.

Context and What to Expect Next

This naming confirms earlier leaks about Qualcomm’s shift to a 2nm process and release of a flagship chip duo. The “Elite” branding aligns with the recent update to Qualcomm’s naming scheme, replacing the previous “Gen” or “Plus” suffixes. The “Elite Extreme” version suggests a higher-tier offering, possibly with enhanced CPU, GPU, or AI capabilities.

More technical details and performance benchmarks will likely surface closer to the Snapdragon Summit. Additional leaks may clarify how these chips differ from each other and from current Snapdragon 8 Gen 2 processors.

Users interested in Xiaomi 18 Pro series releases can watch for which models integrate these Snapdragon 8 Elite Gen 6 chips, as Xiaomi often leads adoption of Qualcomm’s latest flagship platforms.

Previous Coverage

This announcement follows earlier reports about Qualcomm’s upcoming Snapdragon 8 Elite Gen 6 chips featuring Samsung-style HPB cooling and support for LPDDR6 memory types. The new names corroborate prior leaks and clarify Qualcomm’s flagship chip lineup for 2024.

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Emir Bardakçı

Co-founder & HyperOS Expert

Keeping a pulse on Xiaomi, HyperOS, and the Android world. Tech enthusiast, photography lover, and detailed reviewer.

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