New evidence from the Mi Code database has surfaced, revealing Xiaomi’s next-generation foldable powerhouse. After the unexpected cancellation of last year’s prototype, Xiaomi appears to be doubling down on its foldable strategy with a device that marks a significant milestone in the company’s hardware evolution: the transition to proprietary silicon.
The Return of the Fold and the XRING O3
Data from the Mi Code identifies a new device with the model number 2608BPX34C and the internal designation Q18. Within Xiaomi’s internal nomenclature, the “18” series is strictly reserved for the Fold category. Following this logic, Q18 represents the upcoming Xiaomi MIX Fold 5 (or potentially branded as the Xiaomi 17 Fold, though currently identified as the MIX Fold 5).
The most groundbreaking revelation is the processor. The code confirms the device is powered by the XRING O3 chipset. This is the successor to the XRING O1, which made its debut in the 2025 Xiaomi 15S Pro. The XRING O3 represents Xiaomi’s latest achievement in in-house chip design, signaling a strategic shift away from total reliance on external vendors for its premium “Special Edition” Chinese lineups. By the way, Xiaomi MIX Flip 3 will use Snapdragon SoC.
Technically, this model carries the codename “lhasa”. To provide context for enthusiasts, last year’s canceled foldable was developed under the codename “nirvana” with the internal model number O18. By skipping the O18 generation for a commercial release, Xiaomi has focused its resources on “lhasa” to ensure the XRING O3 integration is seamless with Xiaomi HyperOS.
Availability
The Xiaomi MIX Fold 5 is to be launched exclusively in China for its initial run. While pricing is yet to be finalized, industry analysts expect the device to sit in the premium bracket, likely starting around $1,399 to compete with other high-end foldables. The model number suggests a release date of approximately August 2026. Since “8.16” is Xiaomi Day, it may be unveiled at a special event.
The introduction of the XRING O3 in a flagship foldable demonstrates Xiaomi’s confidence in its internal chip division. While these processors are currently limited to high-end Chinese variants, Xiaomi’s long-term roadmap suggests a plan to eventually introduce XRING-powered devices to the Global market once the ecosystem achieves full scale.
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