Xiaomi has officially confirmed that its next-generation XRING chipset will be introduced this year, marking another major step in the company’s self-developed silicon strategy. During a live-streamed event, Xiaomi Group Partner and President Lu Weibing said the next XRING chip “will definitely be iterated this year” and described it as a “very powerful chip” for an “excellent product.”
Exclusive: Xiaomi XRING O3 achieves 4.05GHz, removes big core clusters
This statement directly supports XiaomiTime’s previous exclusive report that Xiaomi is preparing XRING O3, skipping directly from XRING O1 to XRING O3, with the chipset expected to power the upcoming MIX Fold 5 in China.
What Lu Weibing confirmed
Lu Weibing did not reveal the commercial name or full specifications of the chip, but his wording strongly confirms that Xiaomi’s in-house mobile processor roadmap is moving forward in 2026.
He also warned users not to believe every rumor circulating online, while still making it clear that Xiaomi’s next XRING chip will be a major upgrade. This comes after Lei Jun previously confirmed that XRING O1 shipments exceeded 1 million units, proving that Xiaomi’s first modern flagship in-house SoC was not a limited experiment but the foundation of a long-term platform.
XRING O3 expected specifications
According to XiaomiTime’s previous exclusive leak, XRING O3 is expected to bring a radical architecture change compared to XRING O1.
Expected details include:
- Up to 4.05GHz clock speed
- New 3-cluster CPU layout
- Prime + Titanium + Little core structure
- No traditional big-core cluster
- Little cores clocked up to 3.02GHz
- GPU frequency around 1.5GHz
- Around 25% GPU improvement
- 9600 MT/s DRAM support
- China-exclusive availability at launch
This makes XRING O3 one of Xiaomi’s most ambitious chipset projects so far, especially because the company appears to be experimenting with a more aggressive CPU layout instead of following the usual Arm flagship structure.
