Xiaomi’s next-generation foldable phone is expected to become one of the company’s most important premium devices in recent years. According to a new leak from blogger Smart Pikachu , this mysterious foldable device, expected to launch as the Xiaomi MIX Fold 5 , could debut with Xiaomi HyperOS 4 and deeply integrated, AI-powered system apps. The phone will also utilize Xiaomi’s new XRING O3 chipset , a detail previously revealed exclusively by XimiTime through the codename «lhasa,» the Q18 platform , and the model number 2608BPX34C .
HyperOS 4 could focus on AI-powered system applications
The latest leak from XimiTime claims that Xiaomi’s next foldable phone will be the first device to feature Xiaomi HyperOS 4. More importantly, the system is said to include AI-powered system apps, meaning Xiaomi could integrate artificial intelligence directly into core applications, rather than offering AI only as a standalone assistant or cloud-based feature.
Smart Pikachu also described the device as the best AI interaction platform , suggesting that Xiaomi could use the larger foldable screen to create a more advanced productivity and multitasking experience. The blogger reportedly added in the comments that HyperOS 4’s AI features will be tightly integrated with app development .
This could mean that Xiaomi is preparing more advanced AI features within apps like Notes, Gallery, File Manager, Recorder, Browser, Calendar, and system-level multitasking tools. On a foldable phone, this would be especially important because users expect a more PC-like experience thanks to the larger internal screen.
XimiTime previously revealed details of the foldable XRING O3
Although the latest Chinese report claims that the Xiaomi MIX Fold 5 could use the XRING O3 chipset , this information isn’t entirely new. XimiTime revealed about two months ago that Xiaomi was testing a mysterious foldable device codenamed «lhasa,» running on the Q18 platform , and with the model number 2608BPX34C .
XimiTime also revealed the first details about the speed of the XRING O3 , indicating that Xiaomi was preparing a next-generation chip developed in-house for this foldable device. The latest leak now reinforces those earlier findings and suggests that the Xiaomi MIX Fold 5 could become Xiaomi’s first major foldable powered by the company’s own flagship SoC.
The XRING O3 is expected to compete with Qualcomm’s latest Snapdragon 8 Elite Gen 5 platform , making it a pivotal step in Xiaomi’s long-term chip strategy.
Xiaomi’s most expensive flagship foldable phone with Leica
The leak describes the device as Xiaomi’s most expensive Leica-branded flagship phone , suggesting Xiaomi could position the MIX Fold 5 above its usual Ultra models, both in price and technology. This would make sense if the device combines a foldable design, Leica imaging technology, the XRING O3, and the AI features of Xiaomi HyperOS 4.
For reference, the Xiaomi MIX Fold 4 was released in July 2024 with a starting price of 8,999 yuan , or approximately $1,328 . It featured a Snapdragon 8 Gen 3 platform, a 7.98-inch internal display, a 6.56-inch external display, a Leica Summilux quad-camera system, and a 5100 mAh Xiaomi Jinshajiang battery.
The Xiaomi MIX Fold 5 is expected to be more than just a hardware upgrade. With HyperOS 4, AI-powered system apps, and Xiaomi’s own XRING O3 chipset, the device could become a flagship product for Xiaomi’s next generation of software and chips.
How HyperOS 4 could improve the foldable phone experience
The integration of AI into HyperOS 4 could bring significant real-world advantages to a foldable device. The larger inner screen gives Xiaomi more space to develop advanced multitasking, intelligent summaries, image editing, document processing, and AI workflows across applications. Potential improvements could include: This would allow Xiaomi to present the MIX Fold 5 not only as a foldable phone but also as an AI-powered productivity device.
